Product Highlights & Benefits:
• High speed and performance
• Energy efficient
• Improved data handling
• High speed and performance
• Energy efficient
• Improved data handling
Since JEDEC published the DDR3 SDRAM specification in 2007, DDR3 SDRAM is one of the most common DRAM technologies in industrial, embedded as well as a variety of other applications. However, many manufacturers have announced to discontinue DDR3 components.
Thanks to our broad linecard, we still offer a broad range of DDR3 in a variety of configurations from these manufacturers: Chiplus, ESMT, Etron, Intelligent Memory, Nanya, and Winbond.
Density: 1Gb - 8Gb
Speed: 1066MHz
Operating Temperature: commercial and industrial grades
Organisation: x4, x8, x16
Voltage: 1.5V / 1.35V
Package: FBGA78, FBGA96 | Features | DDR3 | DDR2 |
|---|---|---|
| Speed | 1066 MHz | 533 MHz |
| Voltage | 1.5V/1.35V | 1.8V |
| Typical Densities | 1/2/4/8 Gb | 256/512Mb - 1/2 Gb |
| Banks | 8 | 4 |
| Prefetch | 8 Bit | 4 Bit |
No, DDR3 is not backwards compatible with DDR2 or DDR4 due to different pin configurations and electrical standards.
DDR3 remains popular due to its long-term availability, low power consumption, and compatibility with legacy systems.
Our customers are most interested in these DDR3 features: 8Gb, DDR3-1600 to DDR3-1866, 1.5V or 1.35V (DDR3L), x8 / x16 interface, industrial temperature range (−40°C~85°C or up to 95°C for extended versions).
DDR3 demand will be extremely niche beyond 2030. Processor ecosystems are already phasing out DDR3. Support will only remain where customers are willing to commit to wafer banking or custom long-tail supply programs. The availabilty beyond 2030 will be limited to legacy maintenance markets (industrial, defense, aerospace).
Reach out. We are happy to help!
MEMPHIS Electronic GmbH
Basler Str. 5
61352 Bad Homburg
Germany
Phone: +49 6172 90350
Email: info@memphis.de
