The Race to Build the Next Memory Economy

 

AI, Capital and Supply Security Through 2030

 

Thursday, 10 December 2026 | Two Global Live Sessions 

 

 

The semiconductor memory industry is entering a period of structural transformation.

 

AI infrastructure, HBM, advanced packaging and next-generation computing are creating a new memory economy alongside the traditional DRAM and NAND cycle. At the same time, unprecedented capital commitments, technology transitions, regional industrial strategies and long-term supply agreements are redefining where capacity will be built, how it will be allocated and which companies will capture future value.

 

This 2026 Year-End webinar will provide a strategic, data-driven outlook on the forces shaping the global memory industry through 2030.  

 

Key Topics

 

• AI and conventional memory demand convergence
  The interaction between HBM-led growth, hyperscale infrastructure, and traditional server, mobile, PC, automotive, and industrial demand cycles.
  
  
• The global investment and capacity race
  Supplier capital expenditure, fab expansion, advanced-node migration, packaging constraints and the competition for strategic customer commitments.
  
  
• Technology adoption through 2030
  HBM4 and beyond, DDR5, LPDDR5X, CXL, advanced NAND architectures and next-generation packaging technologies.
  
  
• Supply sufficiency and capacity allocation
  The impact of AI-related production priorities on conventional DRAM, NAND and specialty-memory availability.
  
  
• ASP elasticity and system-level optimization
  How rising memory costs influence product configurations, memory content, launch timing, profitability and end-market demand.
  
  
• Regional and application-level divergence
  Different market outcomes across AI infrastructure, enterprise, mobile, PC, automotive and industrial applications—and across EMEA, the Americas and APAC.
  
  
• Supplier positioning and geopolitical realignment
  The evolving strategies of Samsung, SK hynix, Micron, CXMT, YMTC and other global memory suppliers.
  
  
• Resilience and strategic supply commitments
  Practical frameworks for LTAs, MOUs, capacity reservations, multi-sourcing, inventory planning and shared-risk commercial models.
  
  
• 2027–2030 market scenarios
  Implications for technology leadership, capital returns, pricing, supply security, product strategy and competitive positioning.
  
  

Each session will feature a 65-minute strategic market-intelligence presentation, followed by a 10-minute live Q&A session.

 

Participation is free and open to executives, investors, strategy leaders, sourcing and supply-chain professionals, product managers, technology teams, analysts and decision-makers across the global semiconductor and electronics ecosystem.