Multi-Chip Packages combine flash memory with LPDDR components into one single, compact package for smart IoT mobile devices that are increasingly used in retail, transportation, home automation, healthcare, automotive, or security applications. MCPs come in various combinations based on NAND or NOR flash that are stacked with DRAMs ranging from LPDDR1 to LPDDR4x.
We offer MCPs from the following memory manufacturers:
-25°C ~ 85°C
x8 (Flash) / x32 (DRAM)
1.8V – 3.3V
BGA162, FBGA221