logo
Instagram Logo 2 Streamline Icon: https://streamlinehq.com

MEMPHIS Electronic GmbH

Basler Str. 5

D-61352 Bad Homburg

Tel.: +49 6172 90350

E-mail: info@memphis.de

Abonnieren Sie unseren Newsletter

Impressum

Datenschutzerklärung

AGB

Kontakt

logo
Instagram Logo 2 Streamline Icon: https://streamlinehq.com
  • Produkte
    RAM Komponenten
    DDR5DDR4DDR3DDR2DDRSDRAMGDDR7GDDR6GDDR5
    LPDDR5xLPDDR5LPDDR4xLPDDR4LPDDR3LPDDR2LPDDRLPSDR
    SRAMAsynchr. Fast SRAMSynchr. SRAMLow Power SRAMnvSRAMPSRAMFeRAM / FRAMMRAMReRAM
    DRAM Module
    DDR5 ModuleDDR4 ModuleDDR3 ModuleDDR 2 ModuleDDR ModuleSDRAM Module
    Flash Memory
    Serial NORParallel NORSerial NANDParallel NANDeMMCSSDsCompactFlash / CFastSD KartenUFSMulti-Chip Packages / MCPs
  • Linecard
  • Anwendungen
  • Tech Hub
    Unsere Webinare
    Memory Know-How
  • Unternehmen
    Über Uns
    Standorte
    News & Events
    Qualität & Nachhaltigkeit
    Karriere
    Kontakt
STARTSEITE
>UNTERNEHMEN
>NEWSROOM
>NEWSLETTER
>ARE WE FACING A MEMORY DIVIDE?

Are we facing a memory divide?

 26.2.2024

Without a doubt, AI is the hype topic in technology at the moment. It’s significantly shaping and driving memory development as the focus is on high-speed, high-bandwidth and low-power memory technologies. Among these, it’s particularly HBM that is getting a lot of attention. Yole Group predicts impressive growth rates in HBM for 2024 and this is just the beginning, as the major memory players Samsung, Sk hynix and Micron are ramping up their HBM3 memories this year.


Demand is high and supply comes only from a limited number of suppliers, and this has never been a good market condition for industrial customers. Not only is HBM a specialized product, it also requires its own logic, which makes it even more difficult to reach a volume to make it worthwhile for the big three players. So we are seeing a memory divide looming, where industrial applications that require high-bandwidth memory need to be creative and find workarounds for the time being as they simply won’t be able to get HBM. This is a topic that Neumonda is following at the moment, so reach out if you are in this situation, reach out.


But even if you do not require high-end memory, you should still keep an eye out on what’s happening in the market. Although prices are starting to rise, manufacturers are still cautious about ramping up production of standard components. It’s also not clear if or rather which memory products they are going to discontinue to free capacity for new technologies.


So ask yourself: Do you have the memory products that you need for this year?


Mark your calendar for embedded world 2024 (April 9 to 11) that’s a good time to meet in person and discuss your upcoming projects and need.


Check out the full newsletter below.

PDF herunterladen