The world of memory is full of technical terms and abbreviations. In our glossary you will find many technical terms and abbreviations explained in an understandable way and sorted alphabetically.
The AEC-Q100 Component Technical Committee to define common electrical component qualification requirements. These documents contain detailed qualification and requalification requirements and include unique test methods and guidelines for the use of generic data. Components meeting these specifications are suitable for use in harsh automotive environments without additional component level qualification testing.
The memory works independently from the system’s CPU cycle. The responses from the memory related to read and write requests do not directly corelate to system cycles instead occurring asynchronously.
According to AEC-Q100 the following are automotive temperature ratings: Grade 4 (0°C ~70°C); Grade 3 (-40°C~+85°C); Grade 2 (-40°C~+105°C); Grade 1 (-40°C~+125°C) und Grade 0 (-40°C~+150°C) environmental temperature. There are also components that do not have AEC-Q ratings but support specific temperature ranges. (e.g. grade 2).
Air Way Bill, Tracking number, shipping documents
Means buffered / decoupled i.e. A circuit decouples the input and output signals, which relieves the load on the input side of the processor or its memory controller.
Contract Manufacturing Services
Customer Requested Date, Time at which the customer requires the goods.
Customer Sample - Customer samples that are suitable for qualification and correspond to the finished product. In contrast to the engineering sample, which usually works, but does not have all the properties of the finalized product.
Datecode, Date of manufacture formatted as YYWW; for example, 1006, Year 2010, Week 6 or DC09+ : 2009 and newer.
The Dual Inline Package describes a housing for components. In this design, the pins are arranged in two rows on both sides of the component housing. The DIP design is used for memory modules and other active and passive components, and for central processing units (CPU), amplifiers, DIP switches, comparators, resistance networks, LAN controllers, LED units, etc.
Disk on Module (DOM) is a module form of flash memory, which is intended for industrial PCs and for end users. Since the introduction of SSDs (approx. 2009), these devices have only played a role for older devices with an IDE connection. With the help of a DOM as a replacement for commercially available hard disks, a PC can be assembled without moving or noisy parts, if the CPU and power supply are passively cooled and an optical drive is not used.
Dynamic Random Access Memory describes a technology for an electronic random access memory (RAM), which is mainly used in computers, but is also used in other electronic devices such as printers. The storage element is a capacitor that is either charged or discharged. It is accessible via a switching transistor and either read out or written with new content.
The memory content is volatile, which means that the stored information is lost if there is no operating voltage or if it is subsequently refreshed.
Estimated Annual Usage, forecasted annual need for a given product.
Error Correction Code: A type of checksum. Additional data is generated and stored when the user data is stored for the purposes of verifying and possibly correcting the user data during the readout process.
Engineering Sample, an early stage in a product’s lifecycle suitable for initial testing, but potentially not truly representative of the finished product’s complete capabilities.
Extended temperature range e.g. DDR2 / 3/ 4 from -40 ° C to + 95 ° C case temperature.
Joint Electron Device Engineering Council: A large number of companies in the field of semiconductor technology and application have organized themselves under organization in order to define generally applicable standards for electronic semiconductor components.
Mature memory technologies, which are still widely used, but have been replaced by further developments in more modern systems.
Most significant, the supply voltage is reduced from 2.5 to 1.8 V. Additional savings come from temperature-compensated refresh (DRAM requires refresh less often at low temperatures), partial array self refresh, and a "deep power down" mode which sacrifices all memory contents. Additionally, chips are smaller, using less board space than their non-mobile equivalents.
Low Power SDRAM, also known as Mobile RAM, is an SDRAM developed for use in mobile systems, smartphones, notebooks and PDAs. Retaining the same specifications as standard SDRAM related to memory clock and data transfer rates, it reduces the required voltage supply from 3.3V to 1.8V and has a special power down mode which enables a self-refresh when necessary – this allows it to function for extended periods (days or even weeks) with low power supply.
Last Time Buy
A classic Multi Chip Package consists of several individual microchips (or dies), which are planar (side by side) or more often stacked inside a common housing. These MCP packages look and function like a single component. These components are not generally recognizable as MCPs without close examination. Today, the term MCM is also applied to modules which in addition to semiconductor dies contain micromechanical elements or discrete passive components such as capacitors or resistors.
Very low profile - RDIMM in a compact design with a reduced overall height.
Multi-Layer (Flash) Cell is a memory cell/element capable of storing more than a single bit of information, compared to a single-level cell (SLC) which can store only one bit per memory cell/element. A memory cell typically consists of a single MOSFET (metal-oxide-semiconductor field-effect transistor), thus multi-level cells reduce the number of MOSFETs required to store the same amount of data as single-level cells.
Minimum Order Quantity
Moisture Sensitive Level (1/2/3). Sensitivity to moisture: The component can be processed within the stated periods of time without being damaged during the soldering process.
An original design manufacturer (ODM) is a company that designs and manufactures a product, as specified, that is eventually rebranded by another firm for sale.
Product Discontinuation Notice
Product Termination Notification
Quad Flat Package describes a widely used housing design for integrated circuits in electronics. The connections (pins) are located on the four sides of the flat housing. QFP are soldered as surface-mounted components on printed circuit boards.
QFP usually have 32 to 200 pins, which are arranged in a pitch of 0.4 to 1 mm. With a smaller number of connections, the Small Outline Package (SOP or SOIC) is used, in which the pins are arranged on two opposite edges. For larger pin numbers, the Ball Grid Array (BGA) is often used, in which the entire underside serves as a connection area.
A direct predecessor of the QFP was the Plastic Leaded Chip Carrier (PLCC), which uses a larger pin spacing of 1.27 mm (50 mil) and has a significantly larger housing height.
Registered (also called buffered) memory modules have a register between the DRAM modules and the system's memory controller. They place less electrical load on the memory controller and allow single systems to remain stable with more memory modules than they would have otherwise.
Serial ATA (Serial ATAttachment) – also abbreviated as SATA and S-ATA, is a computer interface for data exchange with hard drives and other storage devices. ATA stands for the transmission protocol "AT Attachment", in contrast to which the data is transmitted serially with SATA.
Memory is available in different temperature ranges. The temperature refers to the ambient temperature in which the memory is operated.
The manufacturer must approve the products for the respective temperature ranges.
Ultra Low Profile Registered DIMM; a very compact modular design with a low overall height. It has registers to relieve the address driver lines of the processor unit. Be careful with the height, there is no uniform standard here.
Without buffer. Signal, address and data lines are directly connected between the memory and the processor unit.
Also called 3-dimensional flash. 32, 64 or more individual chips are put together in layers to form a three-dimensional chip construct – as compared to the "planar" or two-dimensional version of multi-chip construction, these forms deliver even higher memory densities.
Very Low Profile unbuffered DIMM; a compact modular design with a low overall height. All data, address and control lines are directly connected to the processor unit.
Very Low Profile Registered DIMM; a compact modular design with a low overall height. It has registers to relieve the address driver lines of the processor unit.